High speed plating method and apparatus



Oct. 4, 1966 TRANSFER MECHANISM STATION I ENTRANCE TANK STATION 2 SOAK CLEAN TANK "TANK 3 STATION *4 WARM RINSE STATION *5 COLD RINSE TANK STATION 6. E ECT. ACID.

STATION 7 COLD RINSE STATION a COLD RINSE TANK STATION 9 COPPER STRIKE TANK STATION Io COPPER PLATE TANK A STATION II RECLAIM RINSE TANK STATION I2 COLD RINSE TANK STATION I3 ELECT CLEAN STATION l4 COLD RINSE R. A. sPAuLOINe ETAL HIGH SPEED PLATING METHOD AND APPARATUS Filed Jul 25, 1962' 1.4 Sheets-Sheet l TANK STATION l6.

COLD RINSE I STATION I'I IDLE STATION l8 TANK DOUBLE NICKEL I STATION IQ TANK DOUBLE NICKEL STATION 20 IDLE STATION aI TANK COLD RIN E STATION 22 AN COLD RINSE STATION 23 TANK ACID STATION 24 COLD RINSE STATION 25 TANK CHROME PLATE STATIO 2e TANK RECLAIM RINSE STATION 27 TANK CHROME P ATE STATION 28 TANK RECLAIM RINSE STATION 29 TANK COLD RINSE STATION 30 TANK HOT RINSE STATION SI ,NVENTORS DRY wr/iivz dg STATION 32 47 ExIT ff "c'v/dfifla/az fwce'Zkw/w, i I Y fiz zd/d/fIWahzz j /fizhzaf/u A TYURNEY Oct. 4,1966 I R. A. SPAULDING ETAL 3,276,978

HIGH SPEED PLATING METHOD AND APPARATUS Filed July 25, 1962 14 Sheets-Sheet 2 ATTORNEY -Oct.'4, 1966 R.A. SPAULDING Em 3,276 918 HIGH SPEED PLATING METHOD AND APPARATUS Filed July 25, 1962 14 Sheets-Sheet 3 ATTORIVEY -4,1 66 A. SPAULDING TAL v 3,276,978

HIGH SPEED PLATING METHOD AND APPARATUS ATYDRNEY Oct-i 1966: A R. A. SPAULDING AL HIGH SPEED PLATING METHOD AND APPARATUS 'Filed July 25, 1962 l4 Sheets-Sheet 5 R. A. SPAULDING AL HIGH SPEED PLATING METHOD AND APPARATUS 'bct. 4,1966

14 Sheet S-Sh ee't e Filed July 25, 1962 14 Sheet sSheet 7 Oct. 4, 1966 R. A. SPAU LDING ET AL 7 HIGH SPEED PLATING METHOD AND APPARATUS Filed July 25, 1962 Oct. 4, 1 9 66 Y R, A. SPAULDING ETAL 3,276,978

HIGH SPEED PLATING METHOD AND APPARATUS if Z5 v IJVVEWQRS w fl W win -4. JZWM Z M fizizfi 19 Z 522; M22323; w BY 5%? it 7 W l 9 ATTORNEY Ot. 4, 1966' v R. A. SFY'AULDING ETAL 3,275,978

HIGH SPEED PLATING METHOD AND APPARATUS Filed July 25. 1962 14 Sheatsiheet 9 AMA/E) 1966 R. A. SPAULDING ET AL 3,276,978

I 7 HIGH SPEED PLATING METHOD AND APPARATUS Fiiqd Jul 25, 1962 v v 14 Sheets-Sheet 10 ATTORNEY Oct 4,1966 R.SPAUI DING ETAL 3,

' men SPEED PLATING METHOD AND APPARATUS Filo d 31 1125, 1962 14 Sheets-Sheet 11 A TTORA/EYS' ELECT A ID,

' ACID DIP JV '5 CoLD RINSE I6 Oct. 4, 1966 R. SPAULDING ETAL 3,276,973

HIGH SPEED PLATING METHOD ANDIAPPARATUS I Filed July 25, 1962 r 14 Sheets-Sheet 13 ENTRANCE W SOAK CLEAN ELECT. CLEAN WARM RINSE COLD RINSE CoLD RINSE CoLD RINsE COPPER STRIKE 9 COPPER PLATE Io RECLAIM RINSE ll CoL RINSE l2 ELE T. CLEAN l3 coLD 'RINSE l4 (DMD-mamm- IDLE I7 DouBLE NICKEL l8 DOUBLE NICKEL l9 IDLE CoLD RINsE CoLD RINSE ACID CoLD RINSE CHROME PLATE RECLAIM RINsE CI-IRoME PLATE RECL IM RINSE 25 W45- COLD HOT" RINSE 3o lNl Wfofis Y 3| 1265 1 A. Jada 12%;; EXIT 32- .40 MAfivaa q .1966 R. A. SPAULDING ETAL 3,276,978

HIGH SPEED PLATING METHOD AND APPARATUS Filqd July 25, 1962 i4 Sheets-Sheet 14 2 2%? m WZKKMXMQ. rid/mi A Wf mw fijfiaai a single carrier has inherent disadvantages.

Thisinvention relates to a plating method and apparatus, and more particularly to an electrolytic plating method and apparatus in which workpieces are automatically transported to successive work stations to have various plating operations performed thereon. The invention is particularly directed to a new concept of high quality plating of individual parts on an assembly line basis in amanner providing greatly increased rates of production at substantial reductions incost.

Automatic electroplating machines commonly have a plurality of preparation tanks containing solutions inwhich articles to be plated are immersed for cleaning, rinsing, etching and similar treatments. In addition, plating tanks and finishing tanks for reclaim operations or the like are provided. -In conventional construction, such machines are provided with workpiece carriers adapted to carry multiple workpieces and to beadvanced from tank to tank in a series ofstepsby suitable conveyor mechanism. Elevator mechanism. operating in timed relation with the conveyor .mechanismrisalso provided to raise and lower thecarriers within each individual tanks The workpiece carriers generally comprise racktype structure on which a plurality of individual workpieces are supported. Often, as many as ten or more parts are supported on a single carrier. Thus, racks supporting a plurality of individual articles are moved from tank to tank by the conveyor mechanism and raised and lowered at each tank by the elevator mechanism to immerse the articles in the tanks. It is conventional practice to space the tanks so that a plurality of workpiece carriers can be advanced from one tank to the next on successive movements of a step by step type conveyor. The plating operation is conventionally carried onin large tanks adapted to simultaneously contain a plurality of immersed workpiece carriers which may remain immersed during movement thereof by the conveyor from one end of a plating tank to the other. Y I

The utilizationof large tanks for immersing a plurality of workpiece carriers or even a plurality of workpieces on In particular, a uniform plating thickness on a particular workpiece and between workpieces on a carrier is extremely difiicult to obtain. One of the reasons that the thickness of the plating is not uniform is the dit'ficulty of locating anodes equal distances from all of the parts immersed in the tank. When the workpieces are of intricate configuration the problem of uniform anode spacing is particularly acute. In addition, it'is also diflicult to obtain uniform and accurate plating thicknesses because of variations in process solution contact with particular workpieces. The lack of uniformity of solution contact is due to the fact that many parts are supported on a particular carrier with resultant variations in spacing of each partfrom the other parts,

7 the racks, the anode and the sides of the tank. Most articles having intricate shapes or even simple curves cannot be plated properly during movement through a plating tank because the anodes must be positioned to permit movement of the articles through the tank. Conse- J quently, all portions of the articles have a ditierent spacing from the anodes.

As previously discussed, the variation United States Patent parts.

capable of plating parts, such 3,276,978 Patented- Oct. 4, 1966 2. in spacing of the articles .will be sufiicie'n-t to produce variations in plating thickness. 7

Automobile bumper bars are typical of articles which cannotbe satisfactorily plated while being moved through a plating bath. Such articles are conventionally plated in machines which lower the articles into a tank where they are immersed for treatment. In such machines, the plating is carried on-at a number of treatment positions in one or more tanks. At each position a group of anodes are plaiced Within the tank'so that a workpiece carrier may be lowered to immerse a plurality of workpieces in a pieces relative thereto. 'H we,ver, in order to maintain high production volumes during the plating operation,

many workpieces must be mounted on a particular workpiece carrier. Due to variations in the spacing between individual workpieces and the workpiece carrier, it is i-rn possible to arrange the anodes so that they are equally spaced from all portions of a particular workpiece and from all portions of similar workpieces. 'Although the amount of variation in plating thickness may be reduced by the tank immersion-method, a high proportion of parts are substandard because of considerable variations in plating thickness. In the tank immersion machine the workpiece carriers are delivered to and removed front the processing tanks Y a conveyor and an elevator as previously described. In order to increase rate of production, each of the tanks inusthold a multiplicity of. In tank immersion plating machines of this type, the overall lengths of the plating tanks are extreme. A substantial rate increase 'in plating with this type of machine concurrently involvcsfincidental undesirable results. Hence, such increases are impractical.

The principal object of this invention is to provide a high production, in-line type, plating machine which is as automobile bumpers, at high production rates and with increased uniformity of plating thickness on all portions of the par-ts, including parts having complex compound curvatures. It is a further object of this invention to provide a plating machine inwhich individual parts are plated in separate plating. operations so that the inherent ditiiculties ofmounting a plurality of parts on a conveyor rack are eliminated. Another object is to provide a plating method whereby the plating rate and plating conditions can be precisely controlled for a particular part and whereby the plating operation can be particularly developed for the need of a particular part rather than to meet requirements dictated by simultaneous plating of a plurality of parts in juxtaposition. A further object of this invention is to provide means for plating individual parts so that defective conditions occurring during a plating operation will affect only one part, namely the part being operated on at the time the defect causing condition occurs. Another object of this invention isthe provision of a concept of high production plating which is entirely different from previous commercially feasible high Production plating methods. A further object of this invention is to provide a workpiece plating carrier having an independent solution applying compartment for each workpiece. Still, another object is to provide a workpiece carrier which may be placed in a solution applying position at a pinrality of work stations without immersing the workpiece carrier in a solution tank Another object is to provide an apparatus for electrodepositing metal unusually uniformly at high rates of speed on non-planar surfaces. Yet another purpose of the invention is to provide a method of treating parts to deposit decorative metal coatings of uniform thickness at high rates of speed. In con,-

junction with the provision of new plating apparatus and new methods of plating, a new method of high volume of a palletized plating fixture in processing position as commercial plating has been developed. shown at station 2 in FIGURE 2;

In general, the aforementioned objects of this inven- FIGURE 13 also has an enlarged cross-sectional view tionare accomplished by the use of a palletized plating of a plating cell formed at station 2 in FIGURE 2; fixture for individual parts, which is movable on con- 5 FIGURE 14 containsa cross-sectional view of a porveyor means between a plurality of processing stations tion of the apparatus shown in FIGURE 13 and taken I at which particular plating processes are performed with- 1 along the line 14-14 in FIGURE 13;

in a plating cell formed thereat. The palletized plating FIGURE 15 illustrates a cross-sectional view of, a porfixture is designed toaocommodate individual workpieces tion of the apparatus shown in FIGURE 13' andtaken and to, retain the individualworkpieoes in a predeter- 410 a1ongtheline 15-=-15; t a p 4 mined position throughout the plating process, Individ- FIGURE 16 shows a cross-sectional view taken along ual workpieces are supported during each portion of the line 16-16 and showing a portionof the apparatus plating operation within individual plating cells to which in FIGURE 13;

various plating solutions and plating preparation solu- FIGURE 17 shows a cross-sectional view of a portion tions may be alternately applied without removal of the 15 of the apparatus shown in FIGURE 13 and taken along workpiece from the particular palletized plating fixture the line 17-17;

within which it is originally received. The use of large vFIGURE 18 diagrammatically illustrates the method of tanks to immerse parts to be plated is entirely eliminated transferring palletized plating cells from station to station; and -mechanism required .for elevating workpieces into FIGURE 19 diagrammatically illustrates the method of and out of solution tanks is also entirely eliminated. 20 transferring pallet ze P g cells from station t Station; The prior commercially available part conveying appara- FIGURE 20 contains a plan view of a pallet for a tus, requiring immersion of workpieces within particular plating cell; I

tanks, is replaced so that the neoessaryoperations are FIGURE 21 illustrates an enlarg d S c i nal ieWOf performed within individual plating cells at each of the p a portion of the apparatus shown in FIGURE andtaken agg l e gtagfg s ln Ma nta ner cleaning solutions and 25 l g lbellne 3 s are 0 rou h m iaun u FIGURE -29. at the vanous stations without any repositioning if 31: five embodrmer ie gi' e fih s lu gih zg il i workpiece relative to its initial position in the palletized URE13. I 1

A predetermined Spatial relationships ln general, the present invention comprises the proll W V Wm M M Ill lilolll/lllllll/llll till I li/ly vtalig mg/011215" t l Wm [WM {WWW mwmww mgr/fawn 4w bum/l ,lmuglomwm ecz 411M- t l n one amoral 100 51111 am/a ms a t 1a 40 ewpoqrwcw a; {pa amt yxmzc epomu w b 1,- wt 20 0 /0112 aw 0mg qua/p 10 b agut ca Hm wannasummation 111m owl awaym lswow' 1n wan/9111101 c/etwut 2011410112 9111; 1 S/[OU'liI/JG ine 31-11. 311g; l W ql lq l 1 1, il 69011 ti tbozqou b; we abbmme epomu w [gm 3 swq 191ml "12 ub mq 1/19; 1 1: Imam/1 ohm/ Iona m I 51g 5 11121962911911.9155 t 1 t ldll ll lllf [Hill/912 101! 0g mot (111cm a t 4111 MLfiC/l/tll. ba /118 W I] I I I q mm] AM 0! y ll l/ll/l 6 ll; M AM /WWW con/11a t/ b lu A/t/t a; i bay er [oz 9' l v f llllll l l l l ll ll llllllll a plan Will all pallet fora ll/ll placed so that lll l t I t t FIGURE it illustrates an enlarged sectional view of me nlmmnj 0pm la lit a portion oi the apparatus shown in FIGURE 5 and taken l 1 i l V thereafter carries the palletized plating cell from the load transfer movement; In thismanner, stations which require a longer processing time, compared to the other stations, may be accommodated without disrupting a standard stop period between transfer movement. The particular process solutions at each station are pumped or otherwise delivered under pressure within the processing cell formed thereat to contact the workpiece carried by the palletized plating fixture in a predetermined manner and to accomplish a predetermined result during the standard stop time. At each work station, a particular process solution is applied to the part within the plating cell and subsequently removed from the plating cell before the palletized plating fixture is transferred to the next work station. A plurality of tanks are provided adjacent each work station and suitable pumping means may be provided to convey the fluid from the tanks to the plating cells. In addition, at some stations, a processing material such as rinse water is applied from a central source through retractable shroud housing type fixtures provided at such working stations to form a processing cell with the palletized plating fixture. Suitable tanks are provided below the processing cell to collect rinse water orthe like delivered through the retractable heads. The processing cycle is arranged so that suitable rinsing stations separate processing stations in which activated proc- 6 THE PROCESS V The plating process hereinafter described relates to gcn ernl process requirements since many of the component processes of the complete plating system are variable and dependent on the particular part being processed and the particular result desired. However, it is to be noted that unusually high current densities can be used to obtain a satisfactory decorative electro-deposit having an extremely uniform thickness in a very short period. of time. For purposes of illustration, a standard 30 second dwell, or stop, time is specified for the palletized plating fixture at each station and a standard transfer time of 8 seconds between stations is utilized. operation of the machine is very flexible and other time intervals may be used as desired. The processing se- 'quence for a single workpiece on a single palletized platessing solutions are used. Inthis manner,the palletized Y plating fixtures .are completely washed and cleanedbetween applications of plating solutions so that a solution applied at a particular station is completely washed or rinsed away before the palletized plating fixture arrives at another plating or similar process station. 'The operation of the machine is continuous and the different process solutions are applied to the individual parts supported within the processing cells in a manner in which the application of plating solution to the individual workpiece can be rigidly controlledand in which the position of an anode fixture relative to the surface of the workpiece to be plated is also rigidly controlled and maintained. The capacity of the machine is limited only by the time each individual workpiece must remain at a particular processing station. In order to increase the plating rate of the machine as a'whole, special methods of applying the plating solutions are provided which increase the plating rate substantially relative to previously known methods of plating similar parts on a mass production basis. In this manner, although individual workpieces are plated as compared to plating of a multiplicity of workpieces at a particular station as known in the prior art, the plating rate capable of being achieved with the machine and methock provided by this invention is greatly increased over the plating rate which could be achieved in previous apparatus. In addition, plating quality is also increased.

The control of the platingcycle is facilitated by providing work stations that are equally spaced from one another and by providing equal stop intervals for the palletized plating cells at each of the work stations. In general, each of the palletized plating fixtures is moved an equal distance between each station and remains at each station an equal time. Any necessary deviations from the standard stop time are accommodated by the special transfer mechanism provided which permits an increased process time at particular process stations, such as a plating station, without disrupting the continuous over-all operation of the machine.

ing fixture is shown in FIGURE 1.

The preferred plating process is embodied in a machine comprising thirty-two separate in-line stations and transfer mechanism to successively move individual palletized plating fixtures from station to station. As shown in FIGURE 1, several of the stations are provided with in dividual solution tanks from which various process solutions are applied to processing cells formed by association of cover heads at each station with the palletized plating fixtures. The process sequence for a particular part comprises the preliminary steps of loading the part or workpiece on a cathode mounting fixture which is associated with a pallet to form a palletized plating fixture, and moving the palletized plating fixture to machine entrance station No. 1 whereat the palletized plating fixture is associated with transfer mechanism which controls movement of the palletized plating fixtures from station to station through the machine. As previously discussed, an individual palletized plating'fixture will be located at each processing station during normal full scale production runs. The transfer mechanism moves each individual palletized plating fixture simultaneously from station to station and a standard stop time is utilized for forming a processingcell and applying processing solution at each station. After a palletized plating cell has been loaded with a part and positioned at entrance station No. 1 during a standard stop time, the next movement of the transfer mechanism carries the loaded palletized plating cell from station 1 to cleaning station 2. When the palletized plating cell is in position at station No. 2, a shroud housing in positioned around the workpiece and a cleansing solution is pumped from an adjacent tank to spray apparatus in the shroud housing from which the cleansing solution is sprayed over the workpiece. The cleansing solution flows over the workpiece and returns to the tank through a drain opening extending through the palletized plating fixture and a collection sink provided thereunder. The application of the deans ing solution is completed within the standard stop time and the shroud housing is disassociated from the palletized plating fixture before the next movement of the transfer mechanism which carries the palletized plating fixture from station No. 2 to electrical cleaning'station No. 3 The apparatus provided at station No. 2 and the operations No. 4, 5, 7, 8, 11,12,14, 15, 16, 21, 22, 23, 24, 26,

28, 29, 30 and 31. Therefore, only the process variations are hereinafter described in detail.

' After the palletized plating fixture is properly positioned at station -No. 3, an anode housing is positioned in sealing engagement therewith to form a processing cell and the palletized plating fixture is simultaneously positioned in sealed engagement with a solution applying passage and a solution receiving sink. At the same time, anelectrical connection is obtained between the cathode mounting fixture and an electrical source provided at sta tion No. 3. The anode fixture may be permanently electrically connected since it is permanently located at station No; 3. Cleansing solution is then pumped at a high It is to be noted that the the workpiece on the palletized plating fixture.

, to the adjacent tank.

applying passage,

cal source and the anode housing to prepare the palletized standard stop time that the shroud housingsand trical processing stations No. 6, 9, 10,

rate of flow from an adjacent tank through the solution applying passage and a contoured lower surface of an anode fixture within the into a flow cavity formed between anode housing and a parallel closely spaced surface of The flow cavity encompasses the entire surface to be plated of the workpiece and the cleansing solution flows completely over the outer surface of the workpiece. The anode fixture is electrically energized and the workpiece is electrically energized through contact with the cathode mountthe'pumping of cleansing solution is discontinued and the fixture is disengaged from the solution the solution receiving sink, the electripalletized plating plating fixture for transfer to the next station when the has elapsed. It is to be understood anode housings at the various stations are simultaneously raised and lowered during the standard stop time and therefore no further reference to-the positioning of the housings need be made'in this brief description of the processing steps. The apparatus provided at station No. 3 and the :operation thereof is similar to the apparatus provided at the subsequent elec- 13, 18, 19, 25 and 27 whereat anode housings are provided, Accordingly,

plating fixture is moved to acid dip station No. 15 whereat an acid solution of suitable composition is sprayed over the workpiece to additionally clean'the copper plated workpiece.

After a cold rinse at station No. 16 to remove acid, the moved to either station No. 17

palletized plating cell is or No. 18 depending on whether station No. 17 is empty. Thus, by the provision of anotheridle station No. 20, the

, palletized plating cells can remain at stations No. 18 and only the process variations are hereinafter described'in detail.

The'next movement of the transfer mechanism carries 1 the palletized plating fixture fromstation No. 3 to warm rinsing, station No. 4. After a shroud housing is associated with the palletized plating fixture, warm rinsing solution is pumped from an adjacent tank containing a heating element and appliedto the workpiece.

Before the solution application is discontinued and the shroud housing is disassociated from the plating fixture. The next movement. of the transfer mechanism carries the palletized station No. 4 to cold rinsing station No. 5. Station No. 5 is identical to station No. 4 except that the solution is maintained at a lower temperature. tion may be supplied directly from a central water source and drained to a sewer connecti'onrather than being pumped from and collected in an adjacent tank as at station No. 2. The processing at stations 7,8, 12, 16, 21,22, 24 and 29 is similar.

At station No. 6, an anode housing is associated with the palletized plating fixture and an acid solution of suitable composition is applied to the workpiece at a suitable rate of flow and current density.

The'palletized plating fixture then passes through successive cold rinse stations No. 7 and 8 which are provided to insure a thorough removal of the cleansing acid applied to the palletized plating fixture at station No. 6 without disrupting the standard stop time. In other words, when a longer processing time is required than the standard stop time, a plurality of similar stations maybe provided to enable the application of processing solution for; the required processing time without unnecessarily increasing the stop time at other processing stations which require a lesser processing time.

' Station No. 9 is a copper strike stationwhereat a processing solution of suitable composition is applied at a suitable flow rate and current density.

Station 10 is a copper platestation whereat the workpiece is copper plated by the application of a processing solution of suitable composition at a suitable flow rate and current density.

the stop time elapses,

plating fixture from i The cold rinse solu- Station 11 is a reclaim rinse station whereat copper is 19 for two standard stop periodsand each palletized plating cell stops only at one or the other of stations 18 and 19. At nickel plating stations No. 18 and 19, a nickel plating solution of suitable composition is applied to the workpieces at a suitable flow rate and current density for a suitable period of time.

The palletized plating rinse stationNo. 21 from station No. 19 or-from idle station No. 20 depending on the machine cycle. A second cold rinse station No. 22 insures complete rinsing of the nickel plating solution;

An acid solution of suitable composition is applied to the nickel plated workpiece at station No. 23 to prepare station No. 3 2 for movement of the palletized plating fixture to an unloading station and thereafter to the load ing station and back to, station described.

In summation and by way of further detail, the process shown in FIGURE 1 has been practiced on the left No. 1 as previously corner bar, or wing, of the 1961 Chevrolet front bumper.

The conforming anode used in treating this. part is spaced approximately one-half inch from the surface .of the wing to forma rather extended treatment chamber therebetween. As previously indicated, the solution used to treat the partis passed in one end of the chamber and out the other. through the chamber in this manner 7.1 feet per second for each gallons being pumped through per minute (g.p.m.). Hence, for a rate of flow of 200 g.p.m. the solution velocity in the chamber is about 14.2 feet per second, for 400 g.p.m. the solution velocity is about 28.4 feet per second, for 600 g.p.m. the solution velocity in the chamber is about 42.6 feet per second, etc. Thus, the process shown in FIGUREJ, also involves:

Station 1 An automatic loading station whereat the palletized plating fixture, is automatically loaded on the machine transfer mechanism.

Station 2 A spray cleaning station whereatforeign matter, such as oil,'dirt, buffing compound, etc., on the surface of the part to be plated is removed. The cleaning solution applied will usually be an alkaline type of cleaner of conventional composition comprising alkali, such as caustic soda, phosphate, carbonate, etc., emulsifiers, wetting agents and other soil removing aids. The stop interval is 30 seconds and the cleaning solution is pumped to the part at a rate of approximately 200 g.p.m. at a. temperature of approximately between 100 F. and.

Station 3 An electrolytic cleaning station whereat electrolysis is used to aid in removing foreign matter on the part which was not removed at station 2. The part is electrified fixture is next moved to cold The velocity of the solution flowing is equal to about about 10 a.s.f. can be temperature of between 100 F. and 200 'proximately 120 F. to 190 and an alkaline type cleaning solution is pumped to the part at approximately 300 g.p.n1. and at a temperature of between approximately. 100 F. and 200 F.

. The stop interval is 30 seconds.

I alkalies are removed from the part by spraying tap water at line pressure overthe part. The stop interval is Y 30 seconds.

Station 6 An electrolytic acid station which may be optionally used as an acid dip to neutralize any residual alkaline film 'or as an electrolytic acid for electrolytic polishing f the part. Sulfuric acid or other suitableacid solution,

which may vary from less than 1% to more than 50%- concentration, is used in our preferred process. It is pumped to the part at an approximate rate of1300 gallons per minute and an approximate temperature of 75 F. to 200 F. A current density, anodic or cathodic, of concurrently imposed on the part. This station can also be used for electropolishing, if desired- The stop interval is 30 seconds.

- Stations 7 and 8 Cold n'nsestations whereat any residual acid, solution is removed by tap water at line pressure. The stop interval is 30 seconds at each station. V

' Station 9 Y A copper strike station whereat a flash" of copper is deposited on the part to provide a base for subsequent operations that will promote adhesion. A conventional V cyanide copper solution is pumped to the part at an approximate rate of 600 g.p.m. and at an approximate F. The part is electrified. The stop interval is 30 seconds.

Station 10 A copper plate station whereatsutficient copper is deposited to provide a suitable surface for subsequent bright nickel plating. The part is energized and may be cathodic or periodic reverse plating may be used. The solution is pumped to the part atan approximate'rate of 600 gallons per minute and at a temperature of ap- F. The stop int'e'rval'is 30 seconds.

Station 11 and 12 Cold water rinse stations whereat any cyanide alkaline film residue on the part is removed by tap water pumped at an approximate rate of 100 gallons per minute. The stop interval is 30 seconds at each station;

Station 13 An electrolytic cleaning station which provides a supplementary cleaning to insure a clean surface prior to nickel plating. The part is electrified and an alkaline type cleaning solution is pumped to the part at a rate of approximately 300 gallons per'minuteand at a temperature of approximately 150 F. to 200 F. The stop interval is 30 seconds.

Station 14 A cold water rinse station identical to station 5. 7 Station 15 An acid cleaning station whereat any alkaline film residue remaining from station 13 is removed. An acid solution of sulfuric acid, hydrochloric acid, or any other of 100 F. to 200 10 suitable acid, is pumped to the part at an approximate rate of l00gallons per minute and at approximately room temperature to 200 F. The stop interval is 30 Station 16 A cold water rinse station identical to station 7.

Station I 7 An idle station whereat the part may be located for a stop interval of 30 seconds without any processing to accommodate a stop interval of 60 seconds at stations 18 and 19.

Stations 18 and I9 Nickel plating stations whereat a nickel plating solution is pumped over the part at an approximate rate of 600 gallons per minute and at an approximate temperature F. The part is cathodically energized. The stop interval is 30 seconds or 60 seconds depending on whether a coating of one or two types of nickel is to be applied. In the latter instance, a solution for depositing semi-bright nickel is used at station 18 and a solution for depositing bright nickel is used at station 19.

Station 20 An idle station to accommodate stop intervals of 60 seconds at stations 18 and 19.

Stations 21 and 22 Cold water rinse stations Whereat residual nickel plat ing solution on the part is removed by tap water sprayed thereon at an approximate rate of gallons per minute.- The stop interval is 30 seconds.

Station 23 An acid dip station, whereat the nickel surface on the part is activated prior to chromium plating by application of an acid solution, such as sulphuric acid, and other cone ventional additives which form an activated nickel surface. The acid solution is sprayed over the part at an approximate rate of 100 gallons per minute at room temperature. The stop interval is 30 seconds.

Station 24 A cold water rinse station, whereat residual acid solution is removed. The station is identical to station 5.

Station 25 A chromium plating station, whereat the chromium plating solution is pumped over the par-t at approximately 400 gallons per minute and at an approximate temperature of 100'F. to 200 F. The part, is cathodically energized. The stop interval is 30 seconds.

Station 26 A reclaim rinse station, whereat residual chromium plating solution adhering to the part is removed by room temperature rinse water that is reclaimed. The stop interval is 30 seconds. vi

Station 27 A chromium plating station identical to station 25. Stations 28 and 29 Cold water rinse stat-ions whereat residual chromium plating solution is removed. The stations are identical to station 11.

Station 30 A hot water rinse station whereat the-rinse water is" heated to an approximate temperature of F. to facili tate subsequent drying of the part. The station is otherwise identical to stations 28 and 29.

Station 31 A part drying station whereat hot an is blown over the part. The stop interval is 30 seconds.

seconds.

An unloading station whereat electrical stations include a Thetwo types of stations are spectively, as shroud stations and anodej stations, and one steel construction having a ports process solution tanks, an

.- bers. of each row and Station 32 the palletized plating fixture is removed from the transfer mechanism and connected to'a conveyor for removal to a part unloading station. The stop interval is 30 seconds.

' THE MACHINE A new and improved plating machine has been pro-- vided to' accomplish the aforementioned processing steps. The processing stations are located in-line along a longi tudinal frame made from structural steel members. Since the machine apparatus is duplicated at many stations, only the first five stations are shown. Furthermore, the various stations are, in general, provided with one or two types of processing apparatus. One type of apparatus is provided at stations where the processing step requires no electrical energization of any of the parts andsuch stations may be referred to as non-electrical stations. othertype of apparatus is provided at stations where the processing step requires cathodic energization of the workpiece and the energization of an anode member. Such stations may be classified. as electrical stations. Nonshroud housing in which spray apparatus is mounted and electrical stations include an anode housing in which'an-anode fixture is mounted.

of each typeof station will be described in detail by reference to the details of the apparatus at shroud station .No. 4 and the details of the apparatus at anode station No. 3, which are exemplary. I

FRAME AND Assocrx'rnn PARTS Referring now to FIGURES 2, 3 and'4, stations 1,2, 3, 4 and of theplating machine to be understood that the other stations are similarly conhereinafter referredto, re-' The" i are shown in detail, and it is 'structed. The machine comprises a frame of structural intermediate section which lowertank' section which supa supports conveyor apparatus and an upper section which supports plating cell forming housings. As shown in FIG- URES 2 and 4, the frame comprising a base formed by spaced horizontally extending 50, 52, 53. A plurality of lowervertical structural members 54, 55, 56, 57, 58 extend upwardly: from the base and form two spaced longitudinal rows of similarly positioned members. The vertical structural members in each row are spaced to define tank accommodating 59,60, 61 for each of the processing stations. ate horizontally extending structural members 62, 63 are compartments lower structural members Intermedb secured to the-upper ends of the vertical structural mern-.

support a conveyor platform plate 66 which extends the length of the machine. A row,of upper vertically extending structural members 67, 68, 69,

I 70 extends longitudinally along one edge of the conveyor platform .66 and another parallel row of identically located structural members 71, 72 extend longitudinally along the opposite edge of the conveyor platform 66. It is to be understood that similar upper vertical members extend the length of the machine. Upper horizontally extending support members 74, 75 are supported on the tops of the upper vertical structural members. Cross support structural members 76, 77 and cross support plates 78, 79, 80

extend transversely between the longitudinally extending structural members 74, 75. In addition, bracket plate members 81, 82 are secured to the top of the cross supports 76, 77 and extend longitudinally of the frame. As shown in FIGURES 4 and 5,.bracket support plates 83, 84 may be secured to the inner side surfaces ofthe upper vertical membersand extend longitudinally of the frame. A transfer mechanism support frame 85 is positioned adjacent one end of the machine frame and supports a transfer mechanism support platform 86 in substantial alignment with the conveyor platform 66.

, nozzlepipe 123 is connected to the .lower ends of the:

Solutions tanks, such as tanks 89, 90, 91, illustrated at.

stations 2, 3 and 4, are provided at some of the stations and are seated in the tank compartments. Conventional pump mechanisms 92, 93, 94

tions, such as station No. 5, an outlet pipe 64 is provided in place of a tank'to conduct processing solution to a several plating stations, electrolyte regenerating tanks (not shown), are also provided adjacent the apparatus and are connectedv central drain system. In addition, at the by suitable piping to the tanks provided beneath each station.

CONVEYOR MEANS plating fixtures. For purposes of illustration, each section of rollers, is, shown to comprise three individualroller members. Referring now to FIGURE 4, the spaced sections of rollers at each of the non electrical stations, such as station No. .4,.comprise baseplates '98, 99which are secured to the support platform66 in any suitable man- 9 ner. Spacedside support plates 100, 101 and 102, 1103,

are secured to the base plates 98, 99 and extend upwardly therefrom. Suitable cross supports may be provided to divide each roller frame section into three roller compart-. ments as shown in FIGURE 3. Support shafts 106, 107

are centrally located in each roller compartment and rotatably support the roller members 95,105. As shown in detail in FIGURE/13, theroller, members have aV- t shaped peripheral cross section which is configured to receive mating portions of each palletized plating fixture during movement of the palletized plating fixtures from station to station. 1 I

Referring again to FIGURE 2, at each station where a processing solution is applied to a workpiece on a palletized plating fixture, solution controlling and confining housings 110, 111, 112,113,114 are vertically movably supported for. movement tion during transfer of palletized plating fixtures from station to stationand an extended lower position of sealing engagement with the palletized plating fixtures to form a processing cell during application of processing solution to t the workpieces. Anode type housings 111, 114 are provided at electrical stations Nos. 3 and 6, and spray type housings 110, 112, 113 are provided atnon-electrical stations Nos. 2, 4 and 5.

SPRAY HOUSlNG Referring now to FIGURE 4, each of the spray housings comprises a rectangular casing 115 formed from sheet metal, or the like and containing a plurality of: spray nozzles 116. The lower portion of the casing isopen and provided with a peripheral rim 117 which is adapted .to be sealingly engaged with an upper surface of each of the palletized plating fixtures 118.. The workpiece, mounted on the palletized plating fixture is centrally positioned within the rectangular casing 115 adjacent the. spray nozzles 116 when the spray housing is, in the extended position. The spray housings are vertically movably supported on pipe members 119, 120 which extend upwardly t through support brackets 121, 122 fixed to the angle plates 81, 82 or other adjacent portions of the frame. A spray pipe members. The pipe 123 is connected to a solution source through suitable piping 124 which is integrally coni nected to one of the support tubes 120. I

are mounted adjacent each of the tanks as shown in FIGURE 53. At some of the stanow to FIGURE 3, a longitudinally extend electrical station may be mounted on individual support,

between a retracted upper. posi- 

2. A METHOD OF APPLYING A PLURALITY OF PROCESSING SOLUTIONS TO A WORKPIECE AT A PLURALITY OF PROCESSING STATIONS COMPRISING THE STEPS OF MOUNTING THE WORKPIECE IN FIXED RELATIONSHIP WITH A PALLETIZED PROCESSING FIXTURE FOR MOVMENT OF THE WORKPIECE IN A FIXED POSITION ON SAID PALLETIZED PROCESSING FIXTURE BETWEEN SAID PROCESSING STATIONS, FORMING A PROCESSING CELL BY SURROUNDINGLY ENGAGING THE PELLETIZED PROCESSING FIXTURE WITH AN ENCLOSING HOUSING, POSITIONING AN ANODE IN A PREDETERMINED SPATIAL RELATIONSHIP WITH SAID WORKPIECE WITHIN SAID PROCESSING CELL TO DEFINE PROCESSING SOLUTION APPLYING PASSAGE BETWEEN SAID ANODE AND SAID WORKPIECE, MOVING THE PALLETIZED PROCESSING FIXTURE FROM STATION TO STATION FOR APPLICATION OF VARYING PROCESS SOLUTIONS, STOPPING THE PALLETIZED PROCESSING FIXTURE AT THE PROCESS STATIONS FOR PREDETERMINED TIME INTERVALS, APPLYING PROCESSING SOLUTION UNDER PRESSURE TO THE WORKPIECE WITH THE PROCESSING CELL AT THE PROCESS STATIONS DURING THE PREDETERMINED TIME INTERVALS, AND SIMULTANEOUSLY ELECTRICALLY ENERGIZING SAID ANODE AND SAID WORKPIECE AT SOME OF SAID STATIONS TO PROVIDE FOR ELECTROLYTIC PROCESSING OF SAID WORKPIECE. 